Invention Grant
- Patent Title: Dual port pass-through midspan
- Patent Title (中): 双端口通过中跨
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Application No.: US14010708Application Date: 2013-08-27
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Publication No.: US09484748B2Publication Date: 2016-11-01
- Inventor: Beny Maymon , Shlomo Elbaz
- Applicant: Microsemi Corp.—Analog Mixed Signal Group Ltd.
- Applicant Address: IL Hod Hasharon
- Assignee: Microsemi Corp.—Analog Mixed Signal Group Ltd.
- Current Assignee: Microsemi Corp.—Analog Mixed Signal Group Ltd.
- Current Assignee Address: IL Hod Hasharon
- Agent Simon Kahn
- Main IPC: H02J3/02
- IPC: H02J3/02 ; H04B3/54 ; H02J4/00 ; G06F1/26 ; H04L12/10 ; G06F1/00

Abstract:
A dual port pass through midspan constituted of: a first port arranged for connection to a first data terminal equipment over a first data communication cabling; a second port arranged for connection to a second data terminal equipment over a second data communication cabling; a first power sourcing equipment arranged to inject power on two of the 4 wire pairs of the first data communication cabling; a second power sourcing equipment arranged to inject power on two of the 4 wire pairs of the second data communication cabling; and a data pass through connection arranged to pass high speed data signals between the first port to the second port, the data pass through connection comprising a direct current blocking circuit arranged to: prevent power from the first power sourcing equipment from appearing at the second port; and prevent power from the second power sourcing equipment from appearing at the first port.
Public/Granted literature
- US20140103707A1 Dual Port Pass-Through Midspan Public/Granted day:2014-04-17
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