Invention Grant
- Patent Title: Acoustic wave device and fabrication method of the same
- Patent Title (中): 声波装置及其制造方法
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Application No.: US13715037Application Date: 2012-12-14
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Publication No.: US09484883B2Publication Date: 2016-11-01
- Inventor: Toshio Nishizawa , Yasuyuki Saito
- Applicant: TAIYO YUDEN CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Chen Yoshimura LLP
- Priority: JP2012-012406 20120124
- Main IPC: H03H9/64
- IPC: H03H9/64 ; H03H9/54 ; H03H9/02 ; H03H3/08 ; H03H9/00 ; H03H9/05 ; H03H9/10 ; H03H9/56
Abstract:
An acoustic wave device includes: a substrate; an input terminal that is located on a first surface of the substrate, and to which a high-frequency signal is input; a resonator that is connected to the input terminal, and to which a high-frequency signal input to the input terminal is input; and an insulating layer that is located between the input terminal and the substrate, and has a permittivity smaller than that of the substrate.
Public/Granted literature
- US20130187730A1 ACOUSTIC WAVE DEVICE AND FABRICATION METHOD OF THE SAME Public/Granted day:2013-07-25
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