Invention Grant
- Patent Title: Acoustic wave band reject filter
- Patent Title (中): 声波波段滤波器
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Application No.: US13726668Application Date: 2012-12-26
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Publication No.: US09484887B2Publication Date: 2016-11-01
- Inventor: Chunyun Jian , Somsack Sychaleun
- Applicant: Telefonaktiebolaget L M Ericsson (publ)
- Applicant Address: SE Stockholm
- Assignee: Telefonaktiebolaget LM Ericsson (publ)
- Current Assignee: Telefonaktiebolaget LM Ericsson (publ)
- Current Assignee Address: SE Stockholm
- Agency: Christopher & Weisberg, P.A.
- Main IPC: H03H9/64
- IPC: H03H9/64 ; H03H9/54 ; H03H9/08 ; H03H9/05 ; H03H3/02 ; H03H3/08 ; H03H9/60 ; H03H9/00
Abstract:
A method and system for an acoustic wave band reject filter are disclosed. According to one aspect, an acoustic wave band reject filter includes a substrate and a plurality of acoustic wave band reject filter blocks. The substrate includes bonding pads formed on the substrate. Each one of the plurality of acoustic wave band reject filter blocks is fixed on a separate die. Each separate die has solder balls on a side of the die facing the substrate. The solder balls are positioned to electrically connect the bonding pads formed on the substrate to positions on each of the die.
Public/Granted literature
- US20140145799A1 ACOUSTIC WAVE BAND REJECT FILTER Public/Granted day:2014-05-29
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