Invention Grant
- Patent Title: Embedded circuit in a MEMS device
- Patent Title (中): MEMS器件中的嵌入式电路
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Application No.: US14665745Application Date: 2015-03-23
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Publication No.: US09485560B2Publication Date: 2016-11-01
- Inventor: Sandra F. Vos , Daniel Giesecke
- Applicant: Knowles Electronics, LLC
- Applicant Address: US IL Itasca
- Assignee: Knowles Electronics, LLC
- Current Assignee: Knowles Electronics, LLC
- Current Assignee Address: US IL Itasca
- Agency: Foley & Lardner LLP
- Main IPC: H04R25/00
- IPC: H04R25/00 ; H04R1/04 ; B81C1/00 ; H04R19/00 ; H04R31/00 ; H01L29/84 ; H04R19/04

Abstract:
A Microelectromechanical System (MEMS) microphone includes a base printed circuit board (PCB), the base PCB having customer pads; at least one wall coupled to the base; a lid PCB coupled to the at least wall, the lid having a port extending there through; an electrically conductive through-hole via extending through the wall electrically connecting the lid PCB to the base PCB; an integrated circuit embedded in the lid and coupled to the electrically conductive through-hole via; and a micro electro mechanical system (MEMS) device coupled to the integrated circuit in the lid and disposed over the port. Sound energy is converted to an electrical signal by the MEMS device and transmitted to the integrated circuit. The integrated circuit processes the signals and sends the processed signals to the customer pads via the electrically conductive through-hole via.
Public/Granted literature
- US20150251898A1 Embedded Circuit In A MEMS Device Public/Granted day:2015-09-10
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