Invention Grant
- Patent Title: Substrate reinforcing structure
- Patent Title (中): 基体加固结构
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Application No.: US14776389Application Date: 2014-03-06
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Publication No.: US09485855B2Publication Date: 2016-11-01
- Inventor: Yuki Ueyama
- Applicant: ENPLAS CORPORATION
- Applicant Address: JP Kawaguchi-Shi, Saitama
- Assignee: ENPLAS CORPORATION
- Current Assignee: ENPLAS CORPORATION
- Current Assignee Address: JP Kawaguchi-Shi, Saitama
- Agency: Staas & Halsey LLP
- Priority: JP2013-053610 20130315
- International Application: PCT/JP2014/055735 WO 20140306
- International Announcement: WO2014/141990 WO 20140918
- Main IPC: H01R13/648
- IPC: H01R13/648 ; H05K1/02 ; H05K3/00 ; H05K1/03 ; H05K1/11 ; H01R12/71 ; G01R31/28 ; H05K3/34
Abstract:
A substrate reinforcing structure for preventing and suppressing deformation or the like of a substrate with a fixed electric component socket.A first reinforcing plate in, for example, a frame shape is attached to a back surface of a wiring board. Further, a second reinforcing plate in, for example, a flat shape is provided on a back side of the first reinforcing plate. In a preferred embodiment of the present invention, a first insulating sheet is further provided between the wiring board and the first reinforcing plate, and a spacer is provided on the second reinforcing plate and abutted to a part of the wiring board where contact pins do not protrude. A second insulating sheet is further provided on the second reinforcing plate.
Public/Granted literature
- US20160037627A1 SUBSTRATE REINFORCING STRUCTURE Public/Granted day:2016-02-04
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