Invention Grant
- Patent Title: Multilayer board
- Patent Title (中): 多层板
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Application No.: US14859625Application Date: 2015-09-21
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Publication No.: US09485860B2Publication Date: 2016-11-01
- Inventor: Kuniaki Yosui
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2013-157830 20130730
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/03 ; H05K3/46 ; H05K1/02

Abstract:
In a flexible board including laminated resin layers containing the same thermoplastic resin as a principal material, a rigid portion includes a region in which a first resin layer is disposed between a second resin layer defining an upper principal surface and a third resin layer defining a lower principal surface so that the rigid portion has a large thickness, and a flexible portion includes a region in which the first resin layer is not disposed between the second and third resin layers so that the flexible portion has flexibility, a step portion at which a thickness changes is between the rigid and flexible portions, and the second and third resin layers extend in a region from the rigid portion beyond the step portion to the flexible portion.
Public/Granted literature
- US20160014893A1 MULTILAYER BOARD Public/Granted day:2016-01-14
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