Invention Grant
- Patent Title: Gas-blowing-hole array structure and soldering apparatus
- Patent Title (中): 气吹孔阵列结构和焊接装置
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Application No.: US14654956Application Date: 2013-12-20
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Publication No.: US09485872B2Publication Date: 2016-11-01
- Inventor: Tsutomu Hiyama
- Applicant: Senju Metal Industry Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Senju Metal Industry Co., Ltd.
- Current Assignee: Senju Metal Industry Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Chernoff, Vilhauer, McClung & Stenzel, LLP
- Priority: JP2012-288293 20121228
- International Application: PCT/JP2013/084296 WO 20131220
- International Announcement: WO2014/103946 WO 20140703
- Main IPC: B23K37/00
- IPC: B23K37/00 ; H05K3/34 ; B23K1/008 ; B23K3/04 ; B23K1/00 ; B23K3/08 ; B23K1/012

Abstract:
In a gas-blowing-hole array structure, which enables gas to be blown to the whole surface of the conveyed member such as a printed circuit board, a semiconductor wafer or the like almost concentrically and allows the whole surface of conveyed member to be very uniformly heated or cooled, a nozzle pattern P2 of blowing nozzles 2 is arranged to be line symmetry with a nozzle pattern P1 of the blowing nozzles 2 in upper and lower divided sections of one side of the nozzle cover 3 relative to a center portion thereof that is orthogonal to a conveying direction, as shown in FIG. 1. In order for the arrangement patterns diagonally arranged in the nozzle cover 3 to become identical, the nozzle pattern P1 is arranged to be line symmetry with the nozzle pattern P2 of the blowing nozzles 2 in upper and lower divided sections of the other side of the nozzle cover 3.
Public/Granted literature
- US20150382482A1 GAS-BLOWING-HOLE ARRAY STRUCTURE AND SOLDERING APPARATUS Public/Granted day:2015-12-31
Information query
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