Invention Grant
- Patent Title: Substrate structure having electronic components and method of manufacturing substrate structure having electronic components
- Patent Title (中): 具有电子部件的基板结构体及具有电子部件的基板结构体的制造方法
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Application No.: US13956293Application Date: 2013-07-31
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Publication No.: US09485878B2Publication Date: 2016-11-01
- Inventor: Jae Soo Lee
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2012-0118028 20121023
- Main IPC: H05K3/46
- IPC: H05K3/46 ; H05K1/18 ; H05K1/02 ; H05K3/34
Abstract:
The present invention relates to a substrate structure having electronic components and a method of manufacturing a substrate structure having electronic components and can reduce signal loss and internal resistance and improve process efficiency by bringing a first terminal of a first electronic component and a second terminal of a second electronic component in direct contact with each other or in direct contact with each other by solder to minimize a path between the electronic components.
Public/Granted literature
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