Invention Grant
- Patent Title: Flat wiring body module
- Patent Title (中): 扁平接线体模块
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Application No.: US14950480Application Date: 2015-11-24
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Publication No.: US09485892B2Publication Date: 2016-11-01
- Inventor: Atsushi Nakata
- Applicant: Yazaki Corporation
- Applicant Address: JP Tokyo
- Assignee: YAZAKI CORPORATION
- Current Assignee: YAZAKI CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2014-238365 20141126
- Main IPC: H01R12/78
- IPC: H01R12/78 ; H05K9/00 ; H01B7/08 ; H02G5/06 ; B60R16/02

Abstract:
A flat wiring body module includes a flat wiring body, a containing member containing the flat wiring body, and a connector part. The flat wiring body includes a flat wiring body for power including a power circuit and a first flat board, a flat wiring body for non-power including a non-power circuit and a second flat board, and a flat wiring body for ground including a ground and a third flat board. The flat wiring body for power, the flat wiring body for non-power, and the flat wiring body for ground are stacked in a state where the flat wiring body for ground is arranged between the flat wiring body for power and the flat wiring body for non-power.
Public/Granted literature
- US20160149329A1 FLAT WIRING BODY MODULE Public/Granted day:2016-05-26
Information query
IPC分类: