A metal foil for electromagnetic shielding, comprising: a metal foil base, an Sn—Ni alloy layer formed on one or both surfaces of the base, and an oxide layer formed on a surface of the Sn—Ni alloy layer, wherein the Sn—Ni alloy layer includes 20 to 80% by mass of Sn and has a thickness of 30 to 500 nm, and wherein when an analysis in a depth direction is carried out by an XPS being the depth from an outermost surface as X nm, and an atomic percentage (%) of Sn is represented by ASn (X), an atomic percentage (%) of Ni is represented by ANi (X), an atomic percentage (%) of oxygen is represented by AO(X), and X is defined to be XO when AO(X)=0, 30 nm=>XO=>0.5 nm, and 0.4=>∫ANi(X)dx/∫ASn(X)dx=>0.05 in a section [0, X0] is satisfied.