Invention Grant
- Patent Title: Residual material detection in backdrilled stubs
- Patent Title (中): 背部钻柱残留物检测
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Application No.: US14462628Application Date: 2014-08-19
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Publication No.: US09488690B2Publication Date: 2016-11-08
- Inventor: Gerald K. Bartley , Darryl J. Becker , Matthew S. Doyle , Philip R. Germann , Mark O. Maxson
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Robert Williams; Nicholas D. Bowman
- Main IPC: G01R1/067
- IPC: G01R1/067 ; G01R31/28 ; B23Q17/20 ; G01R27/26 ; H05K3/00 ; H05K3/42 ; H05K1/02
Abstract:
A stub of a via formed in a printed circuit board is backdrilled to a predetermined depth. A capacitance probe is positioned within the via. Then the capacitance probe is used to obtain a test capacitance measurement. The test capacitance measurement is compared to a predetermined baseline capacitance measurement. Residual conductive plating material in the backdrilled stub causes the test capacitance measurement to exceed the predetermined baseline capacitance measurement. An indication is made that the predetermined baseline capacitance measurement has been exceeded.
Public/Granted literature
- US20150338457A1 RESIDUAL MATERIAL DETECTION IN BACKDRILLED STUBS Public/Granted day:2015-11-26
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