Invention Grant
- Patent Title: Electrowetting device
- Patent Title (中): 电动搅拌装置
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Application No.: US14293328Application Date: 2014-06-02
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Publication No.: US09495919B2Publication Date: 2016-11-15
- Inventor: Ivar Schram , Chiara Cometti
- Applicant: Liquavista B.V.
- Applicant Address: US WA Seattle
- Assignee: Amazon Technologies, Inc.
- Current Assignee: Amazon Technologies, Inc.
- Current Assignee Address: US WA Seattle
- Agency: EIP US LLP
- Priority: GB1120782.6 20111202
- Main IPC: B32B3/02
- IPC: B32B3/02 ; G09G3/34 ; G02B26/00
Abstract:
A method of manufacturing a support plate for an electrowetting device includes providing a first hydrophobic layer on a substrate, reducing the hydrophobicity of a surface of the first hydrophobic layer and providing a second hydrophobic layer on at least part of the surface with reduced hydrophobicity.
Public/Granted literature
- US20140266992A1 ELECTROWETTING DEVICE Public/Granted day:2014-09-18
Information query
