Invention Grant
US09496117B2 Two-dimensional mass resolving slit mechanism for semiconductor processing systems
有权
用于半导体处理系统的二维质量分辨率缝隙机构
- Patent Title: Two-dimensional mass resolving slit mechanism for semiconductor processing systems
- Patent Title (中): 用于半导体处理系统的二维质量分辨率缝隙机构
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Application No.: US14158972Application Date: 2014-01-20
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Publication No.: US09496117B2Publication Date: 2016-11-15
- Inventor: Jason M. Schaller , Robert B. Vopat
- Applicant: Varian Semiconductor Equipment Associates, Inc.
- Applicant Address: US MA Gloucester
- Assignee: Varian Semiconductor Equipment Associates, Inc.
- Current Assignee: Varian Semiconductor Equipment Associates, Inc.
- Current Assignee Address: US MA Gloucester
- Main IPC: G21K1/04
- IPC: G21K1/04 ; H01J37/05 ; H01J37/317 ; H01J37/09

Abstract:
An adjustable mass-resolving slit assembly includes an aperture portion and an actuation portion. The aperture portion includes first and second shield members that define an aperture therebetween for receiving an ion beam during semiconductor processing operations. The actuation portion is coupled to the aperture portion and selectively and independently adjusts the position of the first and second shield members along first and second non-parallel axes. Adjusting the position of the first and second shield members along the first axis adjusts a width of the aperture. Adjusting the position of the first and second shield members along the second axis adjusts a region of the first and second shield members impinged by the ion beam. Methods for using the adjustable mass-resolving slit assembly are also disclosed.
Public/Granted literature
- US20150206701A1 TWO-DIMENSIONAL MASS RESOLVING SLIT MECHANISM FOR SEMICONDUCTOR PROCESSING SYSTEMS Public/Granted day:2015-07-23
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