Invention Grant
US09496405B2 Method for manufacturing semiconductor device including step of adding cation to oxide semiconductor layer
有权
包括将阳离子添加到氧化物半导体层的步骤的半导体器件的制造方法
- Patent Title: Method for manufacturing semiconductor device including step of adding cation to oxide semiconductor layer
- Patent Title (中): 包括将阳离子添加到氧化物半导体层的步骤的半导体器件的制造方法
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Application No.: US13107054Application Date: 2011-05-13
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Publication No.: US09496405B2Publication Date: 2016-11-15
- Inventor: Shunpei Yamazaki , Hideomi Suzawa , Shinya Sasagawa
- Applicant: Shunpei Yamazaki , Hideomi Suzawa , Shinya Sasagawa
- Applicant Address: JP Kanagawa-ken
- Assignee: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Current Assignee: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Current Assignee Address: JP Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office
- Agent Eric J. Robinson
- Priority: JP2010-115940 20100520
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L29/786 ; H01L27/12 ; H01L29/66

Abstract:
An object of an embodiment of the present invention is to provide a semiconductor device including a normally-off oxide semiconductor element whose characteristic variation is small in the long term. A cation containing one or more elements selected from oxygen and halogen is added to an oxide semiconductor layer, thereby suppressing elimination of oxygen, reducing hydrogen, or suppressing movement of hydrogen. Accordingly, carriers in the oxide semiconductor can be reduced and the number of the carriers can be kept constant in the long term. As a result, the semiconductor device including the normally-off oxide semiconductor element whose characteristic variation is small in the long term can be provided.
Public/Granted literature
- US20110287580A1 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2011-11-24
Information query
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