Invention Grant
- Patent Title: Dielectric structure for antennas in RF applications
- Patent Title (中): 射频应用天线的介质结构
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Application No.: US13520739Application Date: 2011-01-06
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Publication No.: US09496596B2Publication Date: 2016-11-15
- Inventor: Laurian Petru Chirila
- Applicant: Laurian Petru Chirila
- Applicant Address: US NY Holtsville
- Assignee: Symbol Technologies, LLC
- Current Assignee: Symbol Technologies, LLC
- Current Assignee Address: US NY Holtsville
- International Application: PCT/US2011/020369 WO 20110106
- International Announcement: WO2011/085097 WO 20110714
- Main IPC: H01Q1/22
- IPC: H01Q1/22 ; H01Q1/38 ; H01Q5/364 ; H01Q1/52 ; H01Q9/04

Abstract:
A dielectric structure for positioning adjacent to an active element of an antenna for radio frequency (RF) applications, the dielectric structure comprising: a plurality of individual dielectric material layers in a stacked layer arrangement including a first layer including a first dielectric material and a second layer including a second dielectric material.
Public/Granted literature
- US20120276311A1 DIELECTRIC STRUCTURE FOR ANTENNAS IN RF APPLICATIONS Public/Granted day:2012-11-01
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