Invention Grant
- Patent Title: Camera module
- Patent Title (中): 相机模块
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Application No.: US14484902Application Date: 2014-09-12
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Publication No.: US09497364B2Publication Date: 2016-11-15
- Inventor: Nae Seong Kim , Hack Ho Kim
- Applicant: LG INNOTEK CO., LTD
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: KED & Associates, LLP
- Priority: KR10-2013-0110441 20130913; KR10-2013-0110442 20130913
- Main IPC: H04N5/225
- IPC: H04N5/225 ; H04N5/232
Abstract:
The camera module according to the present disclosure can improve reliability by mounting a posture sensor on a PCB and promoting a bending prevention of the PCB.
Public/Granted literature
- US20150077628A1 CAMERA MODULE Public/Granted day:2015-03-19
Information query
