Invention Grant
- Patent Title: Printhead die with multiple termination rings
- Patent Title (中): 具有多个端接环的打印头模具
-
Application No.: US14762958Application Date: 2013-01-23
-
Publication No.: US09498953B2Publication Date: 2016-11-22
- Inventor: Anthony M. Fuller , Rio Rivas , Kellie Susanne Jensen
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Houston
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Houston
- Agency: HP Inc—Patent Department
- International Application: PCT/US2013/022626 WO 20130123
- International Announcement: WO2014/116207 WO 20140731
- Main IPC: B41J2/135
- IPC: B41J2/135 ; B41J2/14 ; C23C28/00

Abstract:
A printhead die includes a SiO2 layer grown into a surface of a silicon substrate, and a dielectric layer deposited onto an interior surface area of a substrate. Multiple termination rings are formed around the interior surface area. Each ring is defined by an absence of the dielectric layer. A berm is located in between each termination ring. Each berm is defined by the presence of the dielectric layer.
Public/Granted literature
- US20150352843A1 PRINTHEAD DIE WITH MULTIPLE TERMINATION RINGS Public/Granted day:2015-12-10
Information query
IPC分类: