Invention Grant
- Patent Title: Circuit device
- Patent Title (中): 电路设备
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Application No.: US14339414Application Date: 2014-07-23
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Publication No.: US09502175B2Publication Date: 2016-11-22
- Inventor: Masaya Kawano , Yasutaka Nakashiba
- Applicant: Renesas Electronics Corporation
- Applicant Address: JP Kawasaki-shi, Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kawasaki-shi, Kanagawa
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2008-174111 20080703
- Main IPC: H05K1/16
- IPC: H05K1/16 ; H01F38/14 ; H01F17/00
Abstract:
A circuit device includes a semiconductor substrate, a first inductor provided over the semiconductor substrate, and a second inductor provided over the semiconductor substrate and coupled to the first inductor. The first inductor and second inductor are wound in a same direction with each other from respective inner end portions to respective outer end portions thereof.
Public/Granted literature
- US20140333149A1 CIRCUIT DEVICE Public/Granted day:2014-11-13
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