Invention Grant
- Patent Title: Service tunnel for use on capital equipment in semiconductor manufacturing and research fabs
- Patent Title (中): 用于半导体制造和研究工厂的资本设备的服务隧道
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Application No.: US14887876Application Date: 2015-10-20
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Publication No.: US09502275B1Publication Date: 2016-11-22
- Inventor: David Trussell , John Daugherty , Michael Kellogg , Christopher Pena , Richard Gould , Klay Kunkel
- Applicant: Lam Research Corporation
- Applicant Address: US CA Fremont
- Assignee: Lam Research Corporation
- Current Assignee: Lam Research Corporation
- Current Assignee Address: US CA Fremont
- Agency: Martine Penilla Group, LLP
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/677
Abstract:
A system for processing substrates is provided, comprising: a wafer transport assembly that is configured to transport wafers to and from one or more process modules, the wafer transport assembly having at least one wafer transport module, wherein lateral sides of the at least one wafer transport module are configured to couple to the one or more process modules; a service floor defined below the wafer transport assembly, the service floor being defined at a height that is less than a height of a fabrication facility floor in which the system is disposed.
Information query
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