An integrated circuit includes a signal line and a plurality of shielding structures. The signal line is routed along a first direction and is in a first metallization layer. Each shielding structure includes a plurality of non-contiguous shielding patterns aligned along the first direction. The plurality of shielding structures includes a first and a second shielding structures in a second metallization layer that adjoins the first metallization layer and a third and a fourth shielding structures in a third metallization layer that adjoins the first metallization layer. The first metallization layer is between the second and the third metallization layers. The first and the second shielding structures are separated from each other along a second direction perpendicular to the first direction. The third and the fourth shielding structures are separated from each other along the second direction.