Invention Grant
US09502470B2 Semiconductor memory device and method for manufacturing same 有权
半导体存储器件及其制造方法

Semiconductor memory device and method for manufacturing same
Abstract:
According to one embodiment, a semiconductor memory device includes a substrate including a major surface; a plurality of first films having conductivity or semiconductivity, the first films being provided above the substrate and extending in a first direction inclined with respect to the major surface; a plurality of second films having conductivity, the second films being provided above the substrate and extending in a second direction inclined with respect to the major surface and crossing the first direction; and a plurality of storage films provided in crossing sections of the first films and the second films.
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