Invention Grant
- Patent Title: Semiconductor memory device and method for manufacturing same
- Patent Title (中): 半导体存储器件及其制造方法
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Application No.: US14642911Application Date: 2015-03-10
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Publication No.: US09502470B2Publication Date: 2016-11-22
- Inventor: Atsushi Takahashi , Toshiyuki Sasaki , Tsubasa Imamura
- Applicant: KABUSHIKI KAISHA TOSHIBA
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabrow, Garrett & Dunner LLP
- Priority: JP2014-158941 20140804
- Main IPC: H01L27/24
- IPC: H01L27/24 ; H01L21/311 ; H01L21/3065 ; H01L21/308 ; H01L45/00 ; H01L21/28 ; H01L27/115

Abstract:
According to one embodiment, a semiconductor memory device includes a substrate including a major surface; a plurality of first films having conductivity or semiconductivity, the first films being provided above the substrate and extending in a first direction inclined with respect to the major surface; a plurality of second films having conductivity, the second films being provided above the substrate and extending in a second direction inclined with respect to the major surface and crossing the first direction; and a plurality of storage films provided in crossing sections of the first films and the second films.
Public/Granted literature
- US20160035792A1 SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME Public/Granted day:2016-02-04
Information query
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