Invention Grant
- Patent Title: Embedded sheet capacitor
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Application No.: US14791164Application Date: 2015-07-02
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Publication No.: US09502491B2Publication Date: 2016-11-22
- Inventor: Young Kyu Song , Kyu-Pyung Hwang , Dong Wook Kim , Changhan Hobie Yun
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/00 ; H01L49/02 ; H01L23/64 ; H01L23/498 ; H01L27/08 ; H01L25/16 ; H01G4/30 ; H01G2/06 ; H01G4/012 ; H01L21/48 ; H01L23/522 ; H01G4/12
Abstract:
A multilayer capacitor is provided that includes a plurality of vias configured to receive interconnects from a die.
Public/Granted literature
- US20150311275A1 EMBEDDED SHEET CAPACITOR Public/Granted day:2015-10-29
Information query
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