Invention Grant
- Patent Title: LED module
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Application No.: US14705342Application Date: 2015-05-06
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Publication No.: US09502618B2Publication Date: 2016-11-22
- Inventor: Masahiko Kobayakawa
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: Rohm Co., Ltd.
- Current Assignee: Rohm Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: JP2012-2257 20120110; JP2012-274845 20121217
- Main IPC: H01L33/38
- IPC: H01L33/38 ; H01L33/48 ; H01L33/60
Abstract:
An LED module includes: an LED chip; and a resin case having a reflective surface surrounding the LED chip. An area contact inhibitor to inhibit area contact with an adjacent LED module is formed on an outer surface of the resin case.
Public/Granted literature
- US20150236218A1 LED MODULE Public/Granted day:2015-08-20
Information query
IPC分类:
