Invention Grant
US09503051B2 High-frequency module having a matching element coupled to a connection unit
有权
具有耦合到连接单元的匹配元件的高频模块
- Patent Title: High-frequency module having a matching element coupled to a connection unit
- Patent Title (中): 具有耦合到连接单元的匹配元件的高频模块
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Application No.: US14878078Application Date: 2015-10-08
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Publication No.: US09503051B2Publication Date: 2016-11-22
- Inventor: Morio Takeuchi
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2013-083079 20130411
- Main IPC: H03H9/64
- IPC: H03H9/64 ; H03H9/72 ; H03H9/60 ; H03H9/52 ; H03H9/00

Abstract:
A filter unit of a high-frequency module includes SAW resonators connected in series with first and second series connection terminals therebetween, first and second shunt connection terminals, and additional SAW resonators. One end of one SAW resonator is connected to a connection node of other SAW resonators via a connection conductor, and the other end of the one SAW resonator is connected to the first shunt connection terminal via a connection conductor. The first shunt connection terminal is connected to ground via an inductor. A matching element is connected between the second series connection terminal and the second external connection terminal. The matching element is inductively coupled or capacitively coupled to the connection conductor.
Public/Granted literature
- US20160028364A1 HIGH-FREQUENCY MODULE Public/Granted day:2016-01-28
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