Invention Grant
- Patent Title: Flexible flat circuit
- Patent Title (中): 柔性扁平电路
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Application No.: US14629697Application Date: 2015-02-24
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Publication No.: US09504142B2Publication Date: 2016-11-22
- Inventor: Hisashi Hanazaki
- Applicant: YAZAKI CORPORATION
- Applicant Address: JP Tokyo
- Assignee: YAZAKI CORPORATION
- Current Assignee: YAZAKI CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2014-034209 20140225
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H01B7/08 ; H05K1/18 ; H05K1/03 ; H05K3/10 ; H05K3/12

Abstract:
A flexible flat circuit includes a pair of insulation sheets, and a plurality of conductors that are held between and covered with the pair of insulation sheets in a state that the plurality of conductors are separated to each other. Among from the plurality of conductors, at least conductors with different current capacities are different in thickness to each other.
Public/Granted literature
- US20150245469A1 FLEXIBLE FLAT CIRCUIT Public/Granted day:2015-08-27
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