Invention Grant
US09505612B2 Method for thin film encapsulation (TFE) of a microelectromechanical system (MEMS) device and the MEMS device encapsulated thereof
有权
用于微机电系统（MEMS）器件的薄膜封装（TFE）和其封装的MEMS器件的方法
- Patent Title: Method for thin film encapsulation (TFE) of a microelectromechanical system (MEMS) device and the MEMS device encapsulated thereof
- Patent Title (中): 用于微机电系统（MEMS）器件的薄膜封装（TFE）和其封装的MEMS器件的方法
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Application No.: US14577337Application Date: 2014-12-19
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Publication No.: US09505612B2Publication Date: 2016-11-29
- Inventor: Jae-Wung Lee , Jaibir Sharma , Navab Singh
- Applicant: Agency for Science, Technology and Research
- Applicant Address: SG Singapore
- Assignee: Agency for Science, Technology and Research
- Current Assignee: Agency for Science, Technology and Research
- Current Assignee Address: SG Singapore
- Agency: Schwegman Lundberg & Woessner, P.A.
- Priority: SG201309427-1 20131219
- Main IPC: H01L29/00
- IPC: H01L29/00 ; B81C1/00
Abstract:
A method for thin film encapsulation (TFE) of a microelectromechanical system (MEMS) device, including providing a substrate; forming a MEMS device on the substrate; forming one or more etching channels adjacent to the MEMS device; providing one or more cavities below the MEMS device; and forming one or more cavities above the MEMS device.
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