Invention Grant
US09505613B2 Devices and methods for solder flow control in three-dimensional microstructures
有权
用于三维微结构中焊料流动控制的装置和方法
- Patent Title: Devices and methods for solder flow control in three-dimensional microstructures
- Patent Title (中): 用于三维微结构中焊料流动控制的装置和方法
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Application No.: US14494716Application Date: 2014-09-24
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Publication No.: US09505613B2Publication Date: 2016-11-29
- Inventor: David W. Sherrer , James R. Reid
- Applicant: Nuvotronics, LLC
- Applicant Address: US VA Radford
- Assignee: NUVOTRONICS, INC.
- Current Assignee: NUVOTRONICS, INC.
- Current Assignee Address: US VA Radford
- Agency: Dann, Dorfman, Herrell and Skillman, P.C.
- Agent Niels Haun
- Main IPC: B05D5/12
- IPC: B05D5/12 ; B81C1/00 ; H01L23/00 ; H05K1/11 ; H05K3/40 ; H05K3/34 ; H05K3/32
Abstract:
Structures, materials, and methods to control the spread of a solder material or other flowable conductive material in electronic and/or electromagnetic devices are provided.
Public/Granted literature
- US20150007939A1 Devices and Methods for Solder Flow Control in Three-Dimensional Microstructures Public/Granted day:2015-01-08
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