Invention Grant
- Patent Title: Fabricating pillar solder bump
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Application No.: US14930984Application Date: 2015-11-03
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Publication No.: US09508594B2Publication Date: 2016-11-29
- Inventor: Toyohiro Aoki , Hiroyuki Mori , Kazushige Toriyama
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Jared L. Montanaro
- Priority: JP2013-247505 20131129
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L23/00 ; H01L23/34 ; H01L23/522 ; H01L25/065 ; H01L25/00 ; H01L23/498 ; H01L21/48 ; B23K3/06 ; H01L23/488 ; H01L23/48
Abstract:
A substrate bonding method is able to reliably bond substrates while avoiding a reduction in yield made worse by finer pitches. The substrate bonding method can include: forming an adhesive resin layer on a surface of a first substrate on which a pad has been formed; forming an opening on the adhesive resin layer above the pad; filling the opening with molten solder to form a pillar-shaped solder bump; and applying heat and pressure to the first substrate and a second substrate while a terminal formed on the second substrate is aligned with the solder bump.
Public/Granted literature
- US20160056116A1 FABRICATING PILLAR SOLDER BUMP Public/Granted day:2016-02-25
Information query
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