Invention Grant
- Patent Title: Integrated circuit device and repair method thereof
- Patent Title (中): 集成电路装置及其修理方法
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Application No.: US14797126Application Date: 2015-07-11
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Publication No.: US09508717B2Publication Date: 2016-11-29
- Inventor: Zhenghao Gan
- Applicant: Semiconductor Manufacturing International (Shanghai) Corporation
- Applicant Address: CN Shanghai
- Assignee: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
- Current Assignee: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
- Current Assignee Address: CN Shanghai
- Agency: Anova Law Group, PLLC
- Priority: CN201410363404 20140728
- Main IPC: H03K19/003
- IPC: H03K19/003 ; H01L27/092

Abstract:
The present disclosure provides integrated circuit (IC) devices and repair methods of the IC devices. An IC device includes a PMOS transistor including a substrate, a gate dielectric layer on the substrate, and a gate on the gate dielectric layer. The IC device also includes a repair circuit configured to apply a negative bias voltage to the substrate of the PMOS transistor, when the PMOS transistor is in an OFF state, to cause injections of electrons in the substrate into the gate dielectric layer to neutralize holes caused by negative bias temperature instability (NBTI) effect. The repair circuit is further configured to stop applying the negative bias voltage to the substrate of the PMOS transistor when the PMOS transistor is in an ON state. As such, the disclosed IC device repairs defect caused by NBTI effect in the PMOS transistor and prolongs the lifespan of the PMOS transistor.
Public/Granted literature
- US20160028376A1 INTEGRATED CIRCUIT DEVICE AND REPAIR METHOD THEREOF Public/Granted day:2016-01-28
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