Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US14734140Application Date: 2015-06-09
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Publication No.: US09508730B2Publication Date: 2016-11-29
- Inventor: Ki Hong Lee , Seung Ho Pyi
- Applicant: SK hynix Inc.
- Applicant Address: KR Icheon-Si
- Assignee: SK HYNIX INC.
- Current Assignee: SK HYNIX INC.
- Current Assignee Address: KR Icheon-Si
- Agency: William Park & Associates LTD.
- Priority: KR10-2015-0033817 20150311; KR10-2015-0054732 20150417
- Main IPC: H01L27/115
- IPC: H01L27/115 ; H01L27/24

Abstract:
A semiconductor device includes a substrate in which a cell region and contact regions located at both sides of the cell region are defined, a first source layer formed over the substrate, a second source layer formed over the first source layer, a reinforcement pattern formed in the second source layer, a stacked structure including conductive layers and insulating layers alternately stacked over the second source layer and the reinforcement pattern, channel layers passing through the stacked structure and the second source layer and electrically coupled to the second source layer, and an isolation insulating pattern passing through at least one top conductive layer of the conductive layers.
Public/Granted literature
- US20160268263A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2016-09-15
Information query
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