Invention Grant
- Patent Title: Solar cell metallisation and interconnection method
- Patent Title (中): 太阳能电池金属化和互连方法
-
Application No.: US14764128Application Date: 2014-01-30
-
Publication No.: US09508884B2Publication Date: 2016-11-29
- Inventor: Stuart Ross Wenham , Matthew Bruce Edwards , Alison Joan Lennon , Pei Chieh Hsiao , Budi Santoso Tjahjono
- Applicant: NewSouth Innovations Pty Limited
- Applicant Address: AU Sydney, NSW
- Assignee: NEWSOUTH INNOVATIONS PTY LIMITED
- Current Assignee: NEWSOUTH INNOVATIONS PTY LIMITED
- Current Assignee Address: AU Sydney, NSW
- Priority: AU2013900310 20130131; AU2013900351 20130204
- International Application: PCT/AU2014/000058 WO 20140130
- International Announcement: WO2014/117216 WO 20140807
- Main IPC: H01L31/00
- IPC: H01L31/00 ; H01L31/05 ; H01L31/0224 ; H01L31/068 ; H01L31/18 ; C25D3/60 ; C25D5/10 ; C25D5/50 ; C25D5/56 ; C25D7/12 ; H01L31/02 ; H01L31/0203 ; C25D5/00

Abstract:
A solar cell and a method of forming a contact structure on a solar cell having a p-n junction formed between a first semiconductor region of a first dopant polarity and a second semiconductor region of a second dopant polarity opposite to the first dopant polarity. The method comprises: forming a plurality of contact points on a surface of the solar cell, whereby the contact points provide an electrical connection to the first semiconductor region; and locating a plurality of conducting wires over the solar cell to make electrical connection to the contact points. The contact points are either an exposed silicon surface or a silicon surface over which metal pads are formed. The metal pads may comprise a plated layer of a low-melting temperature metal and/or may have a thickness of less than 5 microns.
Public/Granted literature
- US20160005903A1 SOLAR CELL METALLISATION AND INTERCONNECTION METHOD Public/Granted day:2016-01-07
Information query
IPC分类: