Invention Grant
- Patent Title: High-speed transimpedance amplifier
- Patent Title (中): 高速互阻放大器
-
Application No.: US14503898Application Date: 2014-10-01
-
Publication No.: US09509260B2Publication Date: 2016-11-29
- Inventor: Tsung-Ching Huang , Chan-Hong Chern , Tao Wen Chung , Ming-Chieh Huang , Chih-Chang Lin
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW
- Agency: Hauptman Ham, LLP
- Main IPC: H03F3/08
- IPC: H03F3/08 ; H03F3/30 ; H03F3/45 ; H03F1/02

Abstract:
A transimpedance amplifier includes a first inverter having a first input node and a first output node. The first input node is configured to receive an input signal. A second inverter has a second input node and a second output node. The second input node connects to a reference voltage terminal. The first inverter and the second inverter are configured to provide a differential output voltage signal between the first output node and the second output node. A first amplifier is configured to provide feedback to the first input node and a second amplifier is configured to provide feedback to the second input node.
Public/Granted literature
- US20150014518A1 HIGH-SPEED TRANSIMPEDANCE AMPLIFIER Public/Granted day:2015-01-15
Information query