Invention Grant
- Patent Title: Acoustic wave device and method of fabricating the same
- Patent Title (中): 声波装置及其制造方法
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Application No.: US14102363Application Date: 2013-12-10
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Publication No.: US09509276B2Publication Date: 2016-11-29
- Inventor: Takuma Kuroyanagi
- Applicant: TAIYO YUDEN CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Chen Yoshimura LLP
- Priority: JP2013-012150 20130125
- Main IPC: H01L41/047
- IPC: H01L41/047 ; H03H9/10

Abstract:
An acoustic wave device includes: a substrate; a functional element formed on the substrate and including an excitation electrode that excites an acoustic wave; a columnar electrode formed on the substrate and electrically connected to the excitation electrode; a metal frame body formed on the substrate and surrounding the functional element and the columnar electrode; and a ceramic substrate sealing the functional element in combination with the metal frame body, a first metal layer bonded to the columnar electrode and a second metal layer bonded to the metal frame body being formed on a surface of the ceramic substrate.
Public/Granted literature
- US09473105B2 Acoustic wave device and method of fabricating the same Public/Granted day:2016-10-18
Information query
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