Invention Grant
- Patent Title: Systems and methods for in-device co-existence interference avoidance for dual connectivity
- Patent Title (中): 用于双连接的设备内共存干扰避免的系统和方法
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Application No.: US14582777Application Date: 2014-12-24
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Publication No.: US09509485B2Publication Date: 2016-11-29
- Inventor: Yujian Zhang , Satish C. Jha , Ali T. Koc , Youn Hyoung Heo , Kathiravetpillai Sivanesan , Rath Vannithamby
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Stoel Rives LLP
- Main IPC: H04W72/08
- IPC: H04W72/08 ; H04L5/14 ; H04W76/04
Abstract:
Systems and methods disclosed herein provide in-device co-existence interference avoidance for a wireless communication device in dual connectivity with a master node and a secondary node. Time-division multiplexing (TDM) assistance information sent by the wireless communication device is forwarded from the master node to the secondary node. The master node and/or the secondary node uses the TDM assistance information to determine a TDM solution for the in-device co-existence interference in the wireless communication device.
Public/Granted literature
- US20150327280A1 SYSTEMS AND METHODS FOR IN-DEVICE CO-EXISTENCE INTERFERENCE AVOIDANCE FOR DUAL CONNECTIVITY Public/Granted day:2015-11-12
Information query
