A multilayer ceramic electronic component includes a ceramic body including dielectric layers; and first and second internal electrodes having at least one of the dielectric layers interposed therebetween. Each of the first internal electrodes includes a first electrode plate and a first lead connected to the first electrode plate, the first lead being exposed to a first surface of the ceramic body and having a bent shape. Each of the second internal electrodes includes a second electrode plate and a second lead connected to the second electrode plate, the second lead being exposed to a second surface of the ceramic body and having a bent shape. A portion of the first lead overlaps the second electrode plate, and a portion of the second lead overlaps the first electrode plate.