A wiring board includes a first wiring layer, a first insulating layer, first via wirings, connection terminals and a protection layer. The first insulating layer is formed with through holes. The first via wirings are formed in the through holes. The connection terminals are electrically connected to the first wiring layer through the first via wirings. The connection terminals protrude upward from the first insulating layer. The protection layer is made of insulating resin which contains photosensitive resin as a main component. The protection layer is formed on an upper surface of the first insulating layer. The protection layer includes first and second protection layers. The first protection layer surrounds the connection terminals. The second protection layer is separated from the first protection layer. The second protection layer is thinner than the first protection layer.