Invention Grant
- Patent Title: Semiconductor devices capable of self-curing
- Patent Title (中): 能自愈的半导体器件
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Application No.: US14197588Application Date: 2014-03-05
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Publication No.: US09520401B2Publication Date: 2016-12-13
- Inventor: Sungsam Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-Si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2013-0058470 20130523
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L27/108 ; H01L27/02

Abstract:
A semiconductor device includes a plurality of first signal lines crossing a plurality of second signal lines. At least one of the first signal lines has a first end to receive a first voltage and a second end to receive a second voltage. The first and second voltages are applied simultaneously to respective ones of the first and second ends. A difference between the first and second voltages causes joule heating in the at least one first signal line. The joule heating may correct one or more defects in the semiconductor device.
Public/Granted literature
- US20140346580A1 SEMICONDUCTOR DEVICES CAPABLE OF SELF-CURING Public/Granted day:2014-11-27
Information query
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