Invention Grant
- Patent Title: Apparatus and method for induction motor heat transfer
- Patent Title (中): 感应电动机传热装置及方法
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Application No.: US13605389Application Date: 2012-09-06
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Publication No.: US09520755B2Publication Date: 2016-12-13
- Inventor: Nicholas G. Lang , Donald J. Schenk
- Applicant: Nicholas G. Lang , Donald J. Schenk
- Applicant Address: US GA Alpharetta
- Assignee: SIEMENS INDUSTRY, INC.
- Current Assignee: SIEMENS INDUSTRY, INC.
- Current Assignee Address: US GA Alpharetta
- Main IPC: H02K9/22
- IPC: H02K9/22 ; H02K5/18 ; H02K9/06 ; H02K9/08 ; H02K9/14

Abstract:
A heat sink apparatus for induction motors and other dynamoelectric machines. The heat sink has a mounting portion adapted for coupling to a motor housing. A first heat sink portion is adapted for insertion into a motor housing interior, such as through an aperture in the frame or bearing bracket, and is thermally coupled to a second heat sink portion that is adapted for orientation outside the housing. The heat sink apparatus first heat sink portion may be inserted within an air channel of a TEFC induction motor. The heat sink preferably has a higher heat transfer rate than the motor housing.
Public/Granted literature
- US20140062227A1 APPARAUS AND METHOD FOR INDUCTION MOTOR HEAT TRANSFER Public/Granted day:2014-03-06
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