Invention Grant
- Patent Title: Vibration damping circuit card assembly
- Patent Title (中): 振动阻尼电路卡组合
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Application No.: US14196203Application Date: 2014-03-04
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Publication No.: US09521753B1Publication Date: 2016-12-13
- Inventor: Ronald Allen Hunt
- Applicant: The United States of America as Represented by the Administrator of the National Aeronautics and Space Administration
- Applicant Address: US DC Washington
- Assignee: The United States of America as Represented by the Administrator of the National Aeronautics and Space Administration
- Current Assignee: The United States of America as Represented by the Administrator of the National Aeronautics and Space Administration
- Current Assignee Address: US DC Washington
- Agent Peter J. Van Bergen; James J. McGroary
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K7/14 ; H05K1/18 ; B65B5/08 ; H05K1/02 ; G06F15/16 ; H02G3/08
Abstract:
A vibration damping circuit card assembly includes a populated circuit card having a mass M. A closed metal container is coupled to a surface of the populated circuit card at approximately a geometric center of the populated circuit card. Tungsten balls fill approximately 90% of the metal container with a collective mass of the tungsten balls being approximately (0.07) M.
Information query
