Invention Grant
- Patent Title: Device case and method of manufacturing the same
- Patent Title (中): 装置情况及其制造方法
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Application No.: US13864116Application Date: 2013-04-16
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Publication No.: US09521771B2Publication Date: 2016-12-13
- Inventor: Hidenori Shishido , Makoto Murakami
- Applicant: GS Yuasa International, Ltd.
- Applicant Address: JP Kyoto-Shi, Kyoto
- Assignee: GS YUASA INTERNATIONAL LTD.
- Current Assignee: GS YUASA INTERNATIONAL LTD.
- Current Assignee Address: JP Kyoto-Shi, Kyoto
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2012-093466 20120417; JP2013-078396 20130404
- Main IPC: H05K5/03
- IPC: H05K5/03 ; H05K13/00 ; H01M2/04 ; B23K15/00 ; B23K26/26 ; B23K26/32
Abstract:
A device case includes: a case body having a side wall and an opening; a lid plate for closing the opening, an end portion of the lid plate being projected from an outer surface of the side wall; and a welded portion that joins the lid plate with the side wall. The lid plate has a beam receiving area located in a vicinity of an end portion of the lid plate for receiving a beam emitted vertically with respect to the beam receiving area.
Public/Granted literature
- US20130270981A1 DEVICE CASE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2013-10-17
Information query
