Invention Grant
- Patent Title: Heat dissipation apparatus
- Patent Title (中): 散热装置
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Application No.: US14500342Application Date: 2014-09-29
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Publication No.: US09521779B2Publication Date: 2016-12-13
- Inventor: Hsien-Huan Chiu
- Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
- Applicant Address: TW New Taipei
- Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee Address: TW New Taipei
- Agent Zhigang Ma
- Priority: TW103110067A 20140318
- Main IPC: H01T23/00
- IPC: H01T23/00 ; H05F3/00 ; H05K7/20 ; G06F1/20

Abstract:
A heat dissipation apparatus includes an insulating plate, a conductive plate located on the insulating plate and a power source with an anode connected with the insulating plate and a cathode connected with the conductive plate. A conductive element is received in the insulating plate and is connected to the anode of the power source. When the heat dissipation apparatus is activated, the conductive element ionizes air closing to the insulating plate to produce positive ions. The conductive plate attracts the positive ions to move fast towards the conductive plate, which cause the air to flow in a direction in which the positive ions move.
Public/Granted literature
- US20150271951A1 HEAT DISSIPATION APPARATUS Public/Granted day:2015-09-24
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