Invention Grant
- Patent Title: Element array and element array laminate
- Patent Title (中): 元素阵列和元素阵列层压板
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Application No.: US13499458Application Date: 2010-07-06
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Publication No.: US09523798B2Publication Date: 2016-12-20
- Inventor: Takayuki Fujiwara , Seiichi Watanabe
- Applicant: Takayuki Fujiwara , Seiichi Watanabe
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2009-227249 20090930
- International Application: PCT/JP2010/061492 WO 20100706
- International Announcement: WO2011/040103 WO 20110407
- Main IPC: B32B5/00
- IPC: B32B5/00 ; G02B3/00 ; B29D11/00

Abstract:
Provided is an element array in which an error in pitch among elements in the element array is absorbed surely in a step of laminating a plurality of element arrays so that each group of the elements arrayed in the laminating direction can be aligned with high accuracy. The element array has a plurality of elements arrayed one-dimensionally or two-dimensionally, and a flexible support formed out of a material richer in elasticity than a material forming the elements. The elements are coupled with one another through the support.
Public/Granted literature
- US20120189800A1 ELEMENT ARRAY AND ELEMENT ARRAY LAMINATE Public/Granted day:2012-07-26
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