A polyamide composition contains the following components: (a) at least 40 parts by weight PA12; (b) 0.1-15 parts by weight of at least one salt with a non-metallic cation; (c) 0.1-25% by weight of at least one dispersant based on esters or amides; (d) a quantity of carbon nanotubes that produces in the molding compound a specific surface resistance according to IEC standard 60167 of maximum 10−1-1010Ω; (e) 0-5 parts by weight of at least one metal salt; and optionally (f) conventional auxiliary substances and additives, the sum of the parts by weight of components (a) to (f) amounting to 100. The polyamide composition can be used for manufacturing moldings with improved electrical conductivity and improved surface quality.