Invention Grant
- Patent Title: Wire harness
- Patent Title (中): 线束
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Application No.: US13817066Application Date: 2011-07-27
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Publication No.: US09524811B2Publication Date: 2016-12-20
- Inventor: Hideomi Adachi , Hidehiko Kuboshima
- Applicant: Hideomi Adachi , Hidehiko Kuboshima
- Applicant Address: JP Tokyo
- Assignee: YAZAKI CORPORATION
- Current Assignee: YAZAKI CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2010-186804 20100824
- International Application: PCT/JP2011/067160 WO 20110727
- International Announcement: WO2012/026272 WO 20120301
- Main IPC: H01B7/00
- IPC: H01B7/00 ; B60R16/02

Abstract:
A wire harness which can absorb a position shift or a dimensional tolerance related to mounting or the like sufficiently is provided. A wire harness (21) includes a harness body (22), a motor side connector (23) provided at one end of the harness body (22), and an inverter side connector (24) provided at the other end of the harness body (22). The harness body (22) includes high voltage conduction paths (25), and an electromagnetic shielding member (26) which collectively covers the high voltage conduction paths (25). The high voltage conduction path (25) includes a conductor body (27), connecting parts (28, 29) and a mold part (30). The conductor body (27) is provided with a tolerance absorbing part (31).
Public/Granted literature
- US20130140055A1 WIRE HARNESS Public/Granted day:2013-06-06
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