Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US14441122Application Date: 2012-11-19
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Publication No.: US09524910B2Publication Date: 2016-12-20
- Inventor: Huilong Zhu
- Applicant: INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES
- Applicant Address: CN Beijing
- Assignee: INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES
- Current Assignee: INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES
- Current Assignee Address: CN Beijing
- Agency: Christensen Fonder P.A.
- Priority: CN201210448013 20121109
- International Application: PCT/CN2012/084818 WO 20121119
- International Announcement: WO2014/071653 WO 20140515
- Main IPC: H01L29/49
- IPC: H01L29/49 ; H01L21/8234 ; H01L27/088 ; H01L29/165 ; H01L29/10 ; H01L29/06 ; H01L29/00 ; H01L21/8238 ; H01L21/84 ; H01L29/66 ; H01L27/092 ; H01L27/12

Abstract:
A semiconductor device and a method for manufacturing the same. An example method may include: forming a first semiconductor layer and a second semiconductor layer sequentially on a substrate; patterning the second and first semiconductor layers to form an initial fin; forming an isolation layer on the substrate, wherein the isolation layer exposes partially the first semiconductor layer, and thus defines a fin above the isolation layer; and forming a gate stack intersecting the fin on the isolation layer, wherein the first semiconductor layer comprises a compound semiconductor, with at least one component whose concentration has a graded distribution in a stack direction of the first and second semiconductor layers.
Public/Granted literature
- US20150340290A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2015-11-26
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