Invention Grant
US09524945B2 Cu pillar bump with L-shaped non-metal sidewall protection structure
有权
铜柱凸起具有L形非金属侧壁保护结构
- Patent Title: Cu pillar bump with L-shaped non-metal sidewall protection structure
- Patent Title (中): 铜柱凸起具有L形非金属侧壁保护结构
-
Application No.: US12781987Application Date: 2010-05-18
-
Publication No.: US09524945B2Publication Date: 2016-12-20
- Inventor: Chien Ling Hwang , Yi-Wen Wu , Chung-Shi Liu
- Applicant: Chien Ling Hwang , Yi-Wen Wu , Chung-Shi Liu
- Applicant Address: TW
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW
- Agency: Hauptman Ham, LLP
- Main IPC: H01L23/488
- IPC: H01L23/488 ; H01L23/00
Abstract:
An L-shaped sidewall protection process is used for Cu pillar bump technology. The L-shaped sidewall protection structure is formed of at least one of non-metal material layers, for example a dielectric material layer, a polymer material layer or combinations thereof.
Public/Granted literature
- US20110285011A1 CU PILLAR BUMP WITH L-SHAPED NON-METAL SIDEWALL PROTECTION STRUCTURE Public/Granted day:2011-11-24
Information query
IPC分类:
