Invention Grant
- Patent Title: Integrated circuit having strained fins on bulk substrate
- Patent Title (中): 集成电路在散装衬底上具有应变片
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Application No.: US14811887Application Date: 2015-07-29
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Publication No.: US09524969B1Publication Date: 2016-12-20
- Inventor: Karthik Balakrishnan , Kangguo Cheng , Pouya Hashemi , Alexander Reznicek
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Harrington & Smith
- Agent Louis J. Percello
- Main IPC: H01L27/00
- IPC: H01L27/00 ; H01L29/06 ; H01L29/78 ; H01L29/16 ; H01L27/092 ; H01L21/8238 ; H01L21/02 ; H01L29/165

Abstract:
A method includes forming a set of fins composed of a first semiconductor material. The method further heats the set of fins to condense the fins and cause growth of a layer of oxide on vertical sidewalls thereof, masking a first sub-set of the fins, forming a plurality of voids in the oxide by removing a second sub-set of fins, where each void has a three-dimensional shape and dimensions that correspond to a three dimensional shape and dimensions of a corresponding removed fin from the second sub-set, and epitaxially growing in the voids a third sub-set of fins. The third sub-set of fins is composed of a second semiconductor material that differs from the first semiconductor material. Each fin of the third subset has a three dimensional shape and dimensions of a corresponding removed fin from the second sub-set. At least one structure formed by the method is also disclosed.
Information query
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