Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US14749416Application Date: 2015-06-24
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Publication No.: US09525066B2Publication Date: 2016-12-20
- Inventor: Kiyotaka Miwa
- Applicant: RENESAS ELECTRONICS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: RENESAS ELECTRONICS CORPORATION
- Current Assignee: RENESAS ELECTRONICS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: McDermott Will & Emery LLP
- Priority: JP2014-130822 20140625
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L21/225 ; H01L29/36 ; H01L29/66 ; H01L21/265 ; H01L29/06 ; H01L29/10

Abstract:
Provided is a technique for promoting miniaturization of a MISFET. A p-type well region is disposed between LDDs (n-type low-concentration regions) of a MISFET (Qn) to cause both the well region and the low-concentration region to partially overlap each other, whereby an overlap region formed of an n-type semiconductor region having a higher resistance than that of the n-type low-concentration region is provided between the p-type well region and each of the n-type low-concentration regions. In this way, the overlap region can relieve an electric field concentration at the end of the n-type low-concentration region, thereby suppressing the occurrence of hot carriers without elongating an offset length of the LDD, which can promote the miniaturization of the MISFET (Qn), particularly, that operates at high voltage.
Public/Granted literature
- US20150380550A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2015-12-31
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