Invention Grant
US09525276B2 ARC fault path for mitigation of ARC fault in power supply enclosure
有权
ARC故障路径,用于减轻电源外壳中的ARC故障
- Patent Title: ARC fault path for mitigation of ARC fault in power supply enclosure
- Patent Title (中): ARC故障路径,用于减轻电源外壳中的ARC故障
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Application No.: US14440810Application Date: 2013-11-06
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Publication No.: US09525276B2Publication Date: 2016-12-20
- Inventor: Jeffrey S. Farr , Kevin D. Wissner , Edward A. Novack , Graham M. Thompson
- Applicant: Jeffrey S. Farr , Kevin D. Wissner , Edward A. Novack , Graham M. Thompson
- Applicant Address: DE München
- Assignee: SIEMENS AKTIENGESELLSCHAFT
- Current Assignee: SIEMENS AKTIENGESELLSCHAFT
- Current Assignee Address: DE München
- International Application: PCT/US2013/068673 WO 20131106
- International Announcement: WO2014/074570 WO 20140515
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H02B1/56 ; H02B13/025 ; H05K7/14 ; H01H33/53 ; H01H33/64 ; H01L23/473 ; H01H33/56

Abstract:
An enclosure for a power supply is provided. An aspect includes a first compartment and a second compartment located adjacent to the first compartment. Another aspect includes an intermediate pressure relief flap located inside the enclosure in between the first compartment and the second compartment, and a top pressure relief flap located on an external surface of the second compartment. Another aspect includes the intermediate pressure relief flap and the top pressure relief flap configured to be closed in the absence of an arc fault in the enclosure, and the intermediate pressure relief flap and the top pressure relief flap configured to open based on the presence of the arc fault in the enclosure, such that plasma from the arc fault vents from the first compartment into the second compartment via the opened intermediate pressure relief flap and out of the second compartment via the opened top pressure relief flap.
Public/Granted literature
- US20150303661A1 ARC Fault Path For Mitigation Of ARC Fault In Power Supply Enclosure Public/Granted day:2015-10-22
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