Invention Grant
- Patent Title: Printed circuit board and manufacturing method thereof
- Patent Title (中): 印刷电路板及其制造方法
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Application No.: US15002028Application Date: 2016-01-20
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Publication No.: US09526164B2Publication Date: 2016-12-20
- Inventor: Han Kim , Dae Hyun Park
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2015-0050943 20150410
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/11 ; H05K3/00
Abstract:
A printed circuit board and a method of manufacturing a printed circuit board are provided. The printed circuit board includes a base, a wiring structure disposed on at least one of a surface and an interior of the base, and a plurality of stitching vias penetrating through the base in a thickness direction along an edge of the base and having side surfaces exposed externally.
Public/Granted literature
- US20160302301A1 PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF Public/Granted day:2016-10-13
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